23-24 June 2020, HSR, Rapperswil
The 2nd Rapperswil International Bonding Forum (RIBF) will take place on the campus of the HSR, University of Applied Sciences, in Rapperswil, Switzerland, on 23rd and 24th June 2020.
The RIBF 2020 conference focuses on bonding technology. The second event of this conference aims at bringing together engineers and researchers from the Industry, Engineering Schools and Universities, to exchange about the state of the art and the latest innovations in the field of bonding technology. The contents of the conference focuses on applied research and industrial applications.
RIBF 2020 focuses especially on the topics of joint design for industrial applications, mechanical properties of adhesive joints including experimental aspects and numerical studies, adhesion and surface treatments, quality procedures and standardisation.
The conference language is English. Presentations will be held in English.